Rigid pin exchangeable kit
Rigid pin exchangeable kits are used to test small test points in small grids precisely and reliably using a high spring force. The contacting is performed using rigid pins (rigid probes), which are guided in a plate stack and deflected by a certain angle. Each rigid pin is assigned a spring-loaded test probe which transmits the spring force to the test point. Using specialised software, the deflection of the rigid pins is determined specifically for each device under test . The calculation is carried out at INGUN. Test points with an contacting range diameter of 0.30 mm can be contacted in a minimum grid of 0.50 mm (data without PCB tolerances when customised by INGUN). Smaller test grids are possible on request.