in electronics
drives innovation


In the field of electronics manufacturing, components are continually becoming smaller - INGUN supports this continuing trend with fine pitch test probes.

The development of the smartphone is a vivid reminder: the integration density and range of functions of electronic components are continually growing. Mechatronics and microelectronics are fields that have constantly developed over the last decades. 

INGUN supports this trend and offers suitable test solutions even for the smallest components and grids - of course with the usual Made in Germany quality.

More components in a smaller space

Primarily, there are different reasons why electronics developers want to increase the integration density of assemblies. For example, surface area, space, or weight can be saved. In addition, there are functional reasons such as shortened signal paths or greater spatial distances between interfering circuit parts. However, one of the most common reasons is to increase the number of functions, i.e., the density of functions that can realised on a PCB or assembly.

Trend towards miniaturisation: Fine pitch is the solution  

INGUN meets the test requirements of increasingly smaller designs and offers an extensive range of test probes to continue to meet the highest quality demands: The so-called fine pitch test probes are used for test points which are very close together - i.e., where contact can no longer be made reliably using a standard test probe.

A basic distinction is made between use with or without a receptacle. If test probes with a receptacle are used, the test probe is exchanged from above in the usual way without interrupting the electrical connection. Pre-wired receptacles are preferred to avoid time-consuming wiring of the receptacles every time probes are replaced.

Innovation from INGUN: Test probes without receptacles

Test probes with plug connection can be used with a receptacle , so that use in even smaller pitch distances is possible. INGUN currently offers solutions for pitches up to ≥25 MIL. The connectors are usually pressed or glued into a plate. The test probes have a floating mount in the probe plate and are centred or secured by means of a retaining/guide plate.

Fine pitch probes have the following advantages:

  • Contacting of very small pads (one grid size smaller than with receptacles)
  • High degree of contacting accuracy thanks to low wobble in the retaining/guide plate
  • Sandwich construction of the test fixture possible
  • Larger drilling tolerances in the probe plate permissible

You can find more about our fine pitch range
in the Test Probes Catalogue from page 51 onwards
or here in our product finder: