OSP coating
OSP-Coating: OSP stands for Organic Surface Protection or Organic Solderability Preservative. It is a thin organic layer which bonds to copper pads on printed circuit boards to protect them from oxidation and ensure good solderability. In contrast to well-known surface finishes, test probes with a high pre-load spring and an aggressive tip style are essential to ensure reliable contact. As contacting OSP-c oated surfaces with gold causes a chemical reaction, using conventional test probes limits contacting possibilities.