In-circuit test (ICT)
During in-circuit testing, all components on the printed circuit board are tested individually. The aim is to detect any assembly, soldering, or electrical faults at an early stage. Test points integrated into the printed circuit board design enable precise contact with spring-loaded test probes.
Typical test criteria and error patterns:
- Continuity, open connections, capacitance, inductance
- Missing, incorrectly soldered, or defective components
- Short circuits and conductor track interruptions
- Defective semiconductor components (short circuit, interruption, incorrect polarity)
Functional circuit test (FCT)
The function test checks the overall function or partial function of an electronic assembly. The subsequent operating environment is simulated in order to realistically assess the electrical behaviour. Contact is made via existing interfaces and accessible test points.
Typical test criteria and error patterns:
- Voltage, current, power, frequency
- Brightness, colour, image and speech recognition
- Temperature, pressure, movement
- Functional errors without clear root cause