INGUN E-TYPE® FUSION

Designed for the most challenging test conditions

INGUN has designed a new test probe series specifically for challenging contacting of tough OSP coatings, lead-free soldering, or contaminated printed circuit boards (PCBs). Despite harsh conditions, these probes achieve outstanding test results, and boast the following features:

Aggressive tip styles
Robust plating
Increased spring pre-load

The tip styles selected for the INGUN E-TYPE® FUSION series are characterised by aggressive edges and excellent edge-retention properties. Especially the newly-developed tip style 70 guarantees reliable contacting of OSP-coated test points without solder thanks to a particularly sharp-edged cutting geometry.

The palladium-nickel plating developed by INGUN guarantees the hardness required to reliably penetrate tough coatings and contamination. The plunger tips in particular withstand contamination well, and are extremely durable and resistant to wear.

The increased spring pre-load ensures deeper penetration of the tip style in the PCB, which improves the contact reliability. Stress on delicate PCBs can be minimised by using the INGUN E-TYPE® FUSION series because lower nominal spring forces can be used to achieve the same contact reliability.

The tried-and-tested double beading guarantees optimum hitting accuracy due to precision-guidance of plungers. In addition, this ensures reliable signal transmission.

Aggressive Tip Styles

The tip styles selected for the INGUN E-TYPE® FUSION series are characterised by aggressive edges and excellent edge-retention properties. Especially the newly-developed tip style 70 guarantees reliable contacting of OSP-coated test points without solder thanks to a particularly sharp-edged cutting geometry.

The palladium-nickel plating developed by INGUN guarantees the hardness required to reliably penetrate tough coatings and contamination. The plunger tips in particular withstand contamination well, and are extremely durable and resistant to wear.

The increased spring pre-load ensures deeper penetration of the tip style in the PCB, which improves the contact reliability. Stress on delicate PCBs can be minimised by using the INGUN E-TYPE® FUSION series because lower nominal spring forces can be used to achieve the same contact reliability.

The tried-and-tested double beading guarantees optimum hitting accuracy due to precision-guidance of plungers. In addition, this ensures reliable signal transmission.

Increased First Pass Yield

For reliable contacting

When contacting test points, first of all it is important to achieve reliable contact. Furthermore, consistent resistance, kept as low as possible, is required to perform measurements which are both precise and repeatable.

The following chart shows results from measurements performed on OSP-coated PCBs. The measurements were conducted up to 50,000 test cycles in the INGUN testing laboratory. During the test, the behaviour of tips style 70 on pads without solder, tip style 98 on open vias, as well as tip style 38 on pads with solder was examined.

The image shows the tip styles selected for the test all achieved reliable contact with the test point. The first pass yield, contact achieved during the first test cycle, is over 99 % in each case. This leads to significant cost and time savings in the test field.

Specialised Plating

For the best edge-retention properties

The palladium-nickel plating, which was specifically developed for the test probes in the INGUN E-TYPE® FUSION series, are characterised by a surface hardness value three times higher than standard gold plating.

With these characteristics solid layers of contamination and top layers, such as OSP can be penetrated without the tip style losing its edge-retention properties, and ultimately its aggressiveness. Another positive effect of the plating is that it repels contamination, which reinforces the self-cleaning effect of each tip style – for unimpaired contact.

Increased Contact force

For reliable penetration of the test surface

The INGUN E-TYPE® FUSION test probes based on the established INGUN E-TYPE® technology and enables the highest contact reliability on the PCB without subjecting it to excessive stress.

This provides a 100 % higher contact force when impacting the test surface, which is achieved by the increased spring pre-load. The FUSION test probes, however, have the same spring force at working stroke as a standard test probe (GKS).

The additional contact force initially gained ensures reliable penetration of insulated top layers and a contact surface between probe and PCB which is up to 25 % larger due to the penetration depth.